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1

Archaeology and Early Chinese Glass Trade in Southeast Asia

John N. Miksic, C. T. Yap and Hua Younan

Journal:

Journal of Southeast Asian Studies

Année:

1994

Langue:

english

Fichier:

PDF, 1.43 MB

english, 1994

2

[IEEE 2019 International Conference on IC Design and Technology (ICICDT) - SUZHOU, China (2019.6.17-2019.6.19)] 2019 International Conference on IC Design and Technology (ICICDT) - Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination

Liao, Lois Jinzhi, Zhang, Xi, Li, Xiaomin, Hua, Younan, Fu, Chao, Tee, Weikok, Yee, Boonhwa, Wang, Bisheng, Mao, Songlin

Année:

2019

Langue:

english

Fichier:

PDF, 2.43 MB

english, 2019

3

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Characterization studies of fluorine-induced corrosion crystal defects on microchip Al bondpads using X-ray photoelectron spectroscopy

Younan, Hua, Xiang, Xing Zhen, Xiaomin, Li

Année:

2014

Langue:

english

Fichier:

PDF, 1013 KB

english, 2014

4

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - A study on Al bondpad grain boundaries and galvanic corrosion in wafer fabrication

Année:

2004

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2004

5

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A review on the copper bond pad application in wire bond technique

Jinzhi, Lois Liao, Yan, Chen, Bisheng, Wang, Xiaomin, Li, Chao, Fu, Younan, Hua

Année:

2018

Langue:

english

Fichier:

PDF, 4.82 MB

english, 2018

6

Simultaneous matrix and background correction method and its application in XRF concentration determination of trace elements in geological materials

Younan Hua, C. T. Yap

Journal:

X-Ray Spectrometry

Année:

1994

Langue:

english

Fichier:

PDF, 414 KB

english, 1994

7

A STUDY OF CHINESE PORCELAIN RAW MATERIALS FOR DING, XING, GONGXIAN AND DEHUA WARES

C. T. YAP, YOUNAN HUA

Journal:

Année:

1994

Langue:

english

Fichier:

PDF, 634 KB

english, 1994

8

Raw Materials for Making Jingdezhen Porcelain from the Five Dynasties to the Qing Dynasty

Yap, C. T., Hua, Younan

Journal:

Applied Spectroscopy

Année:

1992

Langue:

english

Fichier:

PDF, 560 KB

english, 1992

9

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - Studies on elimination solutions of galvanic corrosion on microchip Al bondpads in wafer fabrication and assembly processes

Année:

2004

Langue:

english

Fichier:

PDF, 2.11 MB

english, 2004

10

[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Characterization studies of non-stick on pad (NSOP) using AES, XPS and TOF-SIMS

Younan, Hua, Yixin, Chen, Jingjing, Shao, Meng, Hao, Yue, Shen, Zhenxiang, Xing, Yang, Feng, Chao, Fu, Xiaomin, Li

Année:

2014

Langue:

english

Fichier:

PDF, 2.39 MB

english, 2014

11

[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A TOF-SIMS Investigation of the Corrosion-Induced Failure Via Grain Boundaries in Polycrystalline Materials

Yan, Chen, Zilu, Niu, Abella, Erika Therese, Younan, Hua, Xiaomin, Li

Année:

2018

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2018

12

[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Can We Use EDS to Determine Fluorine Contamination Level on A Normal Al Bondpad?

Année:

2018

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2018

13

[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - A study on an abnormal oxidation issue of copper bonding wire

Jinzhi, Lois Liao, Jianbo, Song, Lei, Zhu, Yan, Chen, Nan, Cho, Qinghong, Yao, Chao, Fu, Younan, Hua, Xiaomin, Li

Année:

2019

Fichier:

PDF, 2.00 MB

2019

14

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Failure Analysis of NSOP Problem Due to Al Fluoride Oxide on Microchip Al Bondpads

Siping, Zhao, Younan, Hua, Ramesh, Rao, Li Kun,

Année:

2006

Langue:

english

Fichier:

PDF, 3.47 MB

english, 2006

15

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Studies and applications of standardless EDX quantification method in failure analysis of wafer fabrication

Hua Younan,, Liu Binghai,, Mo Zhiqiang,, Teong, Jennifer

Année:

2008

Langue:

english

Fichier:

PDF, 524 KB

english, 2008

16

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Characterization of Binding Energy of Al Hexafluoride [AlF6]3- in X-Ray Photoelectron Spectroscopy

Année:

2006

Langue:

english

Fichier:

PDF, 667 KB

english, 2006

17

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Quantitative investigation of the adhesion failure of Ti-based metal thin films on Si wafers

Shuting, Chen, Jie, Zhu, Anyan, Du, Younan, Hua

Année:

2012

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2012

18

Estimating Method for Electron Beam Accelerating Voltage Used in Energy‐Dispersive X‐Ray Microanalysis: Application in Failure Analysis of Wafer Fabrication

Journal:

Instrumentation Science & Technology

Année:

2004

Langue:

english

Fichier:

PDF, 423 KB

english, 2004

19

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Failure analysis on ultra-low k film de-lamination by TOF-SIMS composition analysis

Teo, Han Wei, Chen, Shuting, Zhu, Lei, Hua, Younan, Yuan, Zhao Xin, Heng, Yong Seng, Li, Chao Yong

Année:

2012

Langue:

english

Fichier:

PDF, 291 KB

english, 2012

20

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - EELS chemical bond characterization of process induced damages in low-k dielectric films

Zhou, YongKai, Zhu, Jie, Du, AnYan, Hua, YouNan, Zhao, SiPing, Liu, Wei, Zhang, Fan, Tan, Juan Boon

Année:

2012

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2012

21

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - Failure analysis of bondpads peeling problem in 0.13 /spl mu/m copper process in wafer fabrication

Hua Younan,, Rao, N.R., Tan Chin Wang,, Lo Keng Foo,

Année:

2004

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2004

22

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Studies on A Sample Preparation Method for HR-SEM and Application in Failure Analysis of Trench TEOS Gauging Measurement in Wafer Fabrication

Siping, Zhao, Younan, Hua, Zhiqiang, Mo, Ying, Cho Jie

Année:

2006

Langue:

english

Fichier:

PDF, 1.71 MB

english, 2006

23

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Studies on Failure Mechanism of ET High Via Resistance in Wafer Fabrication

Younan, Hua, Khim, Tan Sock, Li Kun,, Siping, Zhao

Année:

2006

Langue:

english

Fichier:

PDF, 924 KB

english, 2006

24

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - XPS and TEM studies of oxidation states on Sn solder ball

Yiqiang, Shen, Yixin, Chen, Sheng, Lee Hwang, Yin, Chow Shue, Xiang, Xing Zhen, Younan, Hua, Xiaomin, Li

Année:

2014

Langue:

english

Fichier:

PDF, 710 KB

english, 2014

25

[ECS 216th ECS Meeting - Vienna, Austria (October 4 - October 9, 2009)] ECS Transactions - Studies on Galvanic Corrosion on Floating and Grounded Bondpads in Wafer Fabrication

Hua, Younan, Ping, Lee Yuan, Rao, Nistala R., Qinghua, Tian

Année:

2009

Langue:

english

Fichier:

PDF, 198 KB

english, 2009

26

[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Fault isolation and TEM study in the state-of-art Thin-Film Transistor

Yongkai Zhou,, Shik Lin Lee,, Chao Fu,, Younan Hua,, Xiaomin Li,

Année:

2015

Langue:

english

Fichier:

PDF, 327 KB

english, 2015

27

[IEEE 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Georgetown, Penang, Malaysia (2016.9.20-2016.9.22)] 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Studies on XPS valence state analysis of copper materials

Younan, Hua, Yue, Shen, Kai, Li, Yuan, Wang Jing, Shen, Chan Yong, Yixin, Chen, Chao, Fu, Xiaomin, Li

Année:

2016

Langue:

english

Fichier:

PDF, 196 KB

english, 2016

28

STUDIES ON PURE ELEMENT INTENSITIES, MASS ABSORPTION COEFFICIENTS AND PARAMETERS ( n AND n o FOR ENERGY-DISPERSIVE X-RAY FLUORESCENCE ANALYSIS

Journal:

Journal of Trace and Microprobe Techniques

Année:

2001

Langue:

english

Fichier:

PDF, 375 KB

english, 2001

29

One-step Synthesis of Metal/Semiconductor Heterostructure NbS2/MoS2

Fu, Qundong, Wang, Xiaowei, Zhou, Jiadong, Xia, Juan, Zeng, Qingsheng, Lv, Danhui, Zhu, Chao, Wang, Xiaolei, Shen, Yue, Li, Xiaomin, Hua, Younan, Liu, Fucai, Shen, Zexiang, Jin, Chuanhong, Liu, Zheng

Journal:

Chemistry of Materials

Année:

2018

Langue:

english

Fichier:

PDF, 4.11 MB

english, 2018

30

[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Studies of Al bondpad qualification methodologies and application in backend process optimization and improvement in wafer fabrication

Année:

2017

Langue:

english

Fichier:

PDF, 490 KB

english, 2017

31

[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Studies of TEM/EDX data process and application in identification of Cu oxide compounds

Younan, Hua, Toh, Karen, Yue, Shen, Bingsheng, Khoo, Xiaomin, Li

Année:

2017

Langue:

english

Fichier:

PDF, 218 KB

english, 2017

32

[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

Liu, Binghai, Hua, Younan, Dong, Zhili, Tan, Pik Kee, Zhao, Yuzhe, Mo, Zhiqiang, Lam, Jeffrey, Mai, Zhihong

Année:

2018

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2018

33

[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance

Bisheng, Wang, Jinzhi, Lois Liao, Xi, Zhang, Xiaomin, Li, Younan, Hua, Weikok, Tee, Boonhwa, Yee, Songlin, Mao, Qinghong, Yao

Année:

2019

Fichier:

PDF, 2.99 MB

2019

34

[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - How To Determine Fluorine Contamination Level On A Normal Al Bondpad?

Année:

2019

Langue:

english

Fichier:

PDF, 951 KB

english, 2019

35

Energy-dispersive XRF analysis of pure element intensities from their oxides using a Cd-109 source

Younan Hua, C. T. Yap

Journal:

X-Ray Spectrometry

Année:

1994

Langue:

english

Fichier:

PDF, 307 KB

english, 1994

36

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics -

Lee, Sharon, Younan, Hua, Siping, Zhao, Zhiqiang, Mo

Année:

2006

Langue:

english

Fichier:

PDF, 1.38 MB

english, 2006

37

Theoretical Studies in EDXRF on a New Linear Relation: ln(Fluorescent Intensity Ratio of Analyte to Pure Analyte/Concentration of Analyte) Versus ln(Fluorescent Energy)

Yap, C. T., Hua, Younan

Journal:

Applied Spectroscopy

Année:

1993

Langue:

english

Fichier:

PDF, 396 KB

english, 1993

38

Experimental Studies in EDXRF on a New Linear Relationship for Fluorescence

Yap, C. T., Hua, Younan

Journal:

Applied Spectroscopy

Année:

1994

Langue:

english

Fichier:

PDF, 386 KB

english, 1994

39

Chinese Greenware Raw Materials: Principal Component Analysis of Major and Minor Chemical Constituents

Yap, Choon-Teck, Hua, Younan

Journal:

Applied Spectroscopy

Année:

1995

Langue:

english

Fichier:

PDF, 623 KB

english, 1995

40

Increased intracellular calcium transients by calmodulin antagonists differentially modulate tumor necrosis factor-α-induced E-selectin and ICAM-1 expression

Kuang-Hua Chen, Benny Hung-Junn Chang, Patrick Younan, Sergiy G Shlykov, Barbara M Sanborn, Lawrence Chan

Journal:

Atherosclerosis

Année:

2002

Langue:

english

Fichier:

PDF, 236 KB

english, 2002

41

Photoluminescence and multiphonon resonant Raman scattering in low-temperature grown ZnO nanostructures

Kumar, Bhupendra, Gong, Hao, Chow, Shue Yin, Tripathy, Sudhiranjan, Hua, Younan

Journal:

Applied Physics Letters

Année:

2006

Langue:

english

Fichier:

PDF, 466 KB

english, 2006

42

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - Studies on X-ray reflectivity technique and application in thickness measurements in wafer fabrication

Ramesh Rao, N., Hua Younan,, Li Kun,, Lo Keng Foo,

Année:

2004

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2004

43

Vibrational Response of Au−Ag Nanoboxes and Nanocages to Ultrafast Laser-Induced Heating

Petrova, Hristina, Lin, Chien-Hua, Hu, Min, Chen, Jingyi, Siekkinen, Andrew R., Xia, Younan, Sader, John E., Hartland, Gregory V.

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 160 KB

english, 2007

44

Studies on Quantification Analysis of Thin Film Layers (Si 3 N 4 , SiO 2 , and TiW) in Wafer Fabrication Using Energy-Dispersive X-Ray Microanalysis Technique and SEC Factors

Journal:

Journal of Trace and Microprobe Techniques

Année:

2003

Langue:

english

Fichier:

PDF, 188 KB

english, 2003

45

[IEEE ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings - Bangi, Malaysia (24-26 Nov. 1998)] ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187) - Elimination of metal bridging failure in VLSI metallization and yield enhancement of FLAT ROM device

Année:

1998

Langue:

english

Fichier:

PDF, 418 KB

english, 1998

46

[IEEE ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings - Bangi, Malaysia (24-26 Nov. 1998)] ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187) - Studies of a new chemical etching method-152 Secco Etch in failure analysis of wafer fabrication

Année:

1998

Langue:

english

Fichier:

PDF, 1.07 MB

english, 1998

47

[IEEE ICSE 2002. IEEE International Conference on Semiconductor Electronics. - Penang, Malaysia (19-21 Dec. 2002)] ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575) - Investigation of aluminium bondpad metal peeling failure

Hua Younan,, Shirley, P., Kee Sze Chonh,, Redkar, S.

Année:

2002

Langue:

english

Fichier:

PDF, 201 KB

english, 2002

48

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - A study on surface charging reduction in Auger electron spectroscopy

Ramesh Rao, N., Tan Chin Wang,, Hua Younan,, Lo Keng Foo,

Année:

2004

Langue:

english

Fichier:

PDF, 1.59 MB

english, 2004

49

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - Failure analysis of discolored and nonstick Al bondpad during wafer sorting process

Hua Younan,, Ramesh Rao, N., Tan Chin Wang,, Lo Keng Foo,

Année:

2004

Langue:

english

Fichier:

PDF, 2.91 MB

english, 2004

50

[IEEE 2006 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2006.10.29-2006.12.1)] 2006 IEEE International Conference on Semiconductor Electronics - Auger PID Characterization of Threshold Voltage Shift and Application in Bond pad Monitoring of Wafer Fabrication

Tan, YH Marcus, Younan, Hua, Timothy, Ling, Siping, Zhao

Année:

2006

Langue:

english

Fichier:

PDF, 1.73 MB

english, 2006